Printed circuit board

ABSTRACT

A printed circuit board according to an embodiment includes: an insulating layer; a first pad disposed on a first surface of the insulating layer; a first conductive layer disposed on the first pad and including gold (Au); a second pad disposed on a second surface of the insulating layer; and a second conductive layer disposed on the second pad and including gold (Au), wherein the first conductive layer is a conductive layer connected to a wire, the second conductive layer is a conductive layer connected to a solder, and the first conductive layer is thicker than the second conductive layer.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. application Ser. No.16/393,323, filed Apr. 24, 2019; which is a continuation of U.S.application Ser. No. 16/146,104, filed Sep. 28, 2018, now U.S. Pat. No.10,347,507, issued Jul. 9, 2019; which claims the benefit under 35U.S.C. § 119 to Korean Patent Application Nos. 10-2017-0127395, filedSep. 29, 2017; and 10-2018-0063237, filed Jun. 1, 2018, all of which arehereby incorporated in their entirety.

TECHNICAL FIELD

The present invention relates to a printed circuit board, and moreparticularly, to a printed circuit board including an upper conductivelayer and a lower conductive layer having different thicknesses at upperand lower portions, and a method of manufacturing the same.

BACKGROUND

A printed circuit board (PCB) is formed by printing a circuit linepattern at an electrical insulating substrate with a conductive materialsuch as copper, and thus the PCB refers to a board just beforeelectronic components are mounted thereon. That is, in order to denselymount various types of electronic components on a planar surface, thePCB refers to a circuit board having a planar surface on which amounting position of each component is fixed and a circuit patternconnecting the components is fixedly printed.

In general, a surface processing method for a circuit pattern includedin the above-described PCB uses an organic solderability preservative(OSP) method, an electrolytic nickel/gold method, an electrolyticnickel/gold-cobalt alloy method, an electroless nickel/palladium/goldmethod, etc.

Here, the above-described surface processing methods vary depending on ause thereof, and the use includes, for example, soldering, wire bonding,and a connector.

FIG. 1 is a view illustrating a printed circuit board according to therelated art.

Referring to FIG. 1, a printed circuit board 10 includes a plurality ofinsulating layers 11, a circuit pattern 12 disposed at a surface of theplurality of insulating layers 11, and a via 13 configured to passthrough at least one among the plurality of insulating layers 11 andelectrically connect circuit patterns disposed at different layers.

In addition, a first pad 14 is disposed on an insulating layer disposedat an uppermost layer among the plurality of insulating layers 11, andan upper conductive layer 15 is disposed on the first pad 14.

Further, a second pad 16 is disposed under an insulating layer disposedat a lowermost layer among the plurality of insulating layers 11, and alower conductive layer 17 is disposed under the second pad 16.

Furthermore, a protective layer 18 having an opening, through which atleast a part of a surface of the lower conductive layer 17 is exposed,is disposed under the insulating layer disposed at the lowermost layer.

In the above-described printed circuit board 10, pads having differentfunctions are disposed at the uppermost and lowermost portions of theplurality of insulating layers 11, respectively. That is, the first pad14 may be a pad for wire bonding, which is electrically connected to anelectronic component (not shown) via a wire. In addition, the second pad16 may be a pad for soldering, which is electrically connected to anexternal substrate via an adhesive member (not shown).

The upper conductive layer 15 and the lower conductive layer 17 aredisposed at surfaces of the first pad 14 and the second pad 16,respectively. The upper conductive layer 15 and the lower conductivelayer 17 are disposed to perform wire bonding or soldering together witha purpose of inhibiting oxidation of the pad.

However, although thicknesses of the upper conductive layer and thelower conductive layer are different depending on the use of the pad,the upper conductive layer 15 and the lower conductive layer 17 areformed to have the same thickness in the related art. At this point, theupper conductive layer 15 and the lower conductive layer 17 generallyinclude gold (Au). Therefore, in the related art, the thickness of thelower conductive layer 17 is formed based on the thickness required forthe upper conductive layer 15, so that there is a problem that amanufacturing cost due to unnecessary consumption of gold is increased.Further, in the related art, in order to reduce a plating thickness ofthe upper conductive layer or the lower conductive layer including gold,copper/nickel is mainly formed as an underlying layer, so that there isa problem that a product thickness increases due to an increase in thelayer.

SUMMARY

In an embodiment according to the present invention, there is provided aprinted circuit board having a new structure and a method ofmanufacturing the same.

In addition, in an embodiment according to the present invention, thereis provided a printed circuit board capable of electrolytic-plating anupper conductive layer and a lower conductive layer using a plating seedlayer used at the time of forming a pad, and a method of manufacturingthe same.

Further, in an embodiment according to the present invention, there isprovided a printed circuit board capable of forming an upper conductivelayer and a lower conductive layer having different thicknessesdepending on a use of a pad, and a method of manufacturing the same.

Furthermore, in an embodiment according to the present invention, thereis provided a printed circuit board capable of directly forming an upperconductive layer and a lower conductive layer including gold on a padincluding copper, and a method of manufacturing the same.

In addition, in an embodiment according to the present invention, thereis provided a printed circuit board having a pad including a firstpattern having at least a part of an upper surface having a curvatureand a second pattern filling the curvature portion of the first pattern,and a method of manufacturing the same.

Further, in the present invention, there is provided a printed circuitboard including an upper conductive layer and a lower conductive layerhaving a portion on a pad, which protrudes from a side surface of thepad to an outside thereof and at least a part of which is not in contactwith the pad, and a method of manufacturing the same.

Furthermore, the objectives of the present invention are not limited tothe above, and other objectives will be clearly understood to thoseskilled in the art from the following descriptions.

A printed circuit board according to an embodiment includes: aninsulating layer; a first pad disposed on a first surface of theinsulating layer; a first conductive layer disposed on the first pad andincluding gold (Au); a second pad disposed on a second surface of theinsulating layer; and a second conductive layer disposed on the secondpad and including gold (Au), wherein the first conductive layer is aconductive layer connected to a wire, the second conductive layer is aconductive layer connected to a solder, and the first conductive layeris thicker than the second conductive layer.

In addition, the insulating layer includes a plurality of insulatinglayers, the first pad is disposed on an upper surface of an insulatinglayer disposed at an uppermost portion of the plurality of insulatinglayers, and the second pad is disposed under a lower surface of aninsulating layer disposed at a lowermost portion of the plurality ofinsulating layers.

Further, the first pad has a narrower width than the second pad.

Furthermore, the first conductive layer has a thickness in a range of0.2 to 0.8 μm, and the second conductive layer has a thickness in arange of 0.05 to 0.3 μm.

In addition, each of the first pad and the second pad includes a platingseed layer disposed at a surface of the uppermost insulating layer orthe lowermost insulating layer and including copper, a first patterndisposed on the plating seed layer and including copper, and a secondpattern disposed on the first pattern and including copper.

Further, the first pattern is thicker than the second pattern.

Furthermore, a central portion of an upper surface of the first patternis located lower than an outer side portion thereof.

In addition, a part of a lower surface of the second pattern is locatedlower than a part of the upper surface of the first pattern.

Further, each of the first and second conductive layers includes a firstregion in contact with the second pattern, and a second region extendingfrom the first region and spaced apart from the plating seed layer, thefirst pattern and the second pattern, and the second region is not incontact with the plating seed layer, the first pattern, and the secondpattern.

Furthermore, the second region includes a first portion in directcontact with an upper surface of the second pattern and a second portionin direct contact with a side surface of the second pattern.

In addition, the first conductive layer is disposed in plural on thefirst surface of the insulating layer, and the second conductive layeris disposed in plural under the second surface of the insulating layer.

Further, a printed circuit board according to an embodiment includes: aninsulating layer; a pad disposed on the insulating layer; and aconductive layer disposed on the pad, wherein the conductive layerincludes a first region in direct contact with an upper surface of thepad, a second region extending from the first region and in directcontact with a side surface of the pad, and a third region extendingfrom the second region and spaced apart from the pad.

Furthermore, a width of the upper surface of the pad is larger than thatof a lower surface thereof.

In addition, the pad includes a first pad disposed on a first surface ofthe insulating layer, and a second pad disposed on a second surface ofthe insulating layer opposite to the first surface, and the conductivelayer includes a first conductive layer disposed on the first pad andincluding gold (Au), and a second conductive layer disposed on thesecond pad and including gold (Au), and each of the first and secondconductive layers includes the first to third regions.

Further, a thickness of the first region in a longitudinal direction ofthe first conductive layer is larger than that of the first region in alongitudinal direction of the second conductive layer.

Furthermore, a thickness of the second region in a lateral direction ofthe first conductive layer is larger than that of the second region in alateral direction of the second conductive layer.

In addition, each of the first pad and the second pad includes a platingseed layer disposed on the first surface or the second surface of theinsulating layer and including copper, a first pattern disposed on theplating seed layer and including copper, and a second pattern disposedon the first pattern and including copper.

Further, an end portion of the third region of the first conductivelayer is located higher than an outer side region of an upper surface ofthe first pattern constituting the first pad, and an end portion of thethird region of the second conductive layer is located lower than anouter side region of a lower surface of the first pattern constitutingthe second pad.

Furthermore, a thickness of the third region in a longitudinal directionof the first conductive layer is different from that of the third regionin a longitudinal direction of the second conductive layer.

Meanwhile, a method of manufacturing a printed circuit board accordingto an embodiment includes: stacking a plurality of insulating layers andforming a circuit pattern at a surface of the plurality of insulatinglayers; forming first and second plating seed layers at an insulatinglayer disposed at an uppermost portion and an insulating layer disposedat a lowermost portion of the plurality of insulating layers,respectively; forming a first pad and a second pad on the first andsecond plating seed layers, respectively; and proceeding electrolyticplating in a plating tank in which plating spaces on the surface onwhich the first pad is formed and on the surface on which the second padis formed are separated to form a first conductive layer on the firstpad and a second conductive layer on the second pad, wherein the firstconductive layer is formed to have a thickness greater than that of thesecond conductive layer in the same plating tank in which the secondconductive layer is formed.

In addition, the forming of the first conductive layer and the secondconductive layer includes differently applying a plating condition inwhich the first conductive layer is formed and a plating condition inwhich the second conductive layer is formed to simultaneously form thefirst conductive layer and the second conductive layer having differentthicknesses.

Further, each of the first and second conductive layers is formed of ametal including gold.

Furthermore, the forming of the first pad and the second pad includesforming a first pattern, formed of a metal including copper, on thefirst and second plating seed layers, respectively, preprocessing anupper surface of the formed first pattern to have a curvature, andforming a second pattern, formed of a metal including copper, having athickness thinner than the first pattern on the preprocessed firstpattern.

In addition, a part of a lower surface of the second pattern is locatedlower than that of the upper surface of the first pattern.

Further, each of the first and second conductive layers includes a firstregion in contact with the second pattern, and a second region extendingfrom the first region and spaced apart from the plating seed layer, thefirst pattern and the second pattern, wherein the second region is notin contact with the plating seed layer, the first pattern, and thesecond pattern.

Advantageous Effects

According to an embodiment of the present invention, since a secondpattern filling an edge region of a first pattern is formed on the firstpattern, and an upper conductive layer and a lower conductive layer areformed on the formed second pattern, it is possible to solve areliability problem that occurs when the upper conductive layer or thelower conductive layer permeates between a mask.

In addition, according to an embodiment of the present invention, anupper conductive layer and a lower conductive layer are formed after thesecond pattern is formed, so that a portion, protruding from a sidesurface of a pad to an outside thereof, of the upper conductive layerand the lower conductive layer may be minimized, and thus structuralreliability (stability) of the upper conductive layer and the lowerconductive layer can be secured.

Further, according to an embodiment of the present invention, an upperconductive layer and a lower conductive layer are formed after thesecond pattern is formed, so that a portion of a lower surface of thesecond pattern is disposed to be lower than an upper surface of thefirst pattern, and a thickness of the second pattern is thinner thanthat of the first pattern, and thus overspreading itself of the upperconductive layer and the lower conductive layer can be inhibited.

Furthermore, according to an embodiment of the present invention, anupper conductive layer and a lower conductive layer including gold (Au)are formed by using a plating seed layer used at the time of forming thefirst pattern and the second pattern, so that a nickel (Ni) seed layerwhich has served as a seed layer of a gold (Au) conductive layer in therelated art may be removed, and thus, not only a thickness of a printedcircuit board product can be reduced, but also economic efficiency of aproduct can be improved by technical effect due to efficiency of aprocess.

In addition, according to an embodiment of the present invention, anickel layer may be removed from a pattern structure, and thus not onlyelectrical conductivity of a pattern can be improved, but also a problemof interface property occurring between copper and nickel constitutingthe pattern can be solved.

Further, according to an embodiment of the present invention, athickness of an upper conductive layer disposed on a pad for wirebonding and a thickness of a lower conductive layer disposed on a padfor soldering are differently applied, so that a consumption cost ofgold used for the upper conductive layer and the lower conductive layermay be reduced, and thus a thickness can be reduced.

Furthermore, according to an embodiment of the present invention, anupper conductive layer and a lower conductive layer having differentthicknesses may be formed by one simultaneous process, and thusefficiency in a manufacturing process can be improved.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a view illustrating a printed circuit board according to therelated art.

FIG. 2 is a view illustrating a printed circuit board 100 according toan embodiment of the present invention.

FIG. 3 is a view specifically illustrating a first pad 120 and an upperconductive layer 130 shown in FIG. 2

FIG. 4 is a view specifically illustrating a second pad 140 and a lowerconductive layer 150 shown in FIG. 2.

FIGS. 5(a)-5(c) are views illustrating a modified example of an overhangstructure shown in FIGS. 3 and 4.

FIG. 6 is a view illustrating a plating apparatus according to anembodiment of the present invention, and FIG. 7 is a view illustrating adetailed structure of a substrate support of the plating apparatus shownin FIG. 6.

FIGS. 8 to 15 are views for explaining a process sequence of a method ofmanufacturing a printed circuit board according to an embodiment of thepresent invention.

DETAILED DESCRIPTION OF THE EMBODIMENTS

Hereinafter, embodiments of the present invention will be described indetail with reference to the accompanying drawings so that a personskilled in the art to which the present invention belongs can easilycarry out. However, the present invention may be embodied in manydifferent forms and is not limited to the embodiments described herein.

Throughout the specification, when a part is referred to as “including”an element, it means that the part may include other elements as wellwithout excluding the other elements unless specifically statedotherwise.

Further, structures and elements which do not relate to the detaildescription are not shown in the drawings to clearly describe thepresent invention, thicknesses may be exaggerated to clearly explainvarious layers and regions, and similar elements in the followingdescription are designated by similar reference numerals.

It will be understood that when a portion such as a layer, a film, aregion, a plate or the like is referred to as being “on” anotherportion, it can be “directly formed on” another portion, or a thirdportion can be interposed between the portions. Otherwise, when aportion is “directly formed on” another portion, it means that there isno third portion between the portions.

In the present invention, there is provided a new printed circuit board(PCB) on which a surface processing process may be performed afterfilling corner portions of a pattern, etched by a preprocessing process,based on a flash process and a method of manufacturing the same.

In addition, in the present invention, there is provided a printedcircuit board in which an upper conductive layer and a lower conductivelayer are simultaneously formed at a pad for wire bonding disposed at anupper portion of a board and a pad for soldering disposed at a lowerportion of the board and have different thicknesses, and a method formanufacturing the same.

FIG. 2 is a view illustrating a printed circuit board 100 according toan embodiment of the present invention.

Referring to FIG. 2, the printed circuit board 100 includes aninsulating substrate 110, a first pad 120, an upper conductive layer130, a second pad 140, a lower conductive layer 150, a first passivationlayer 160, a second passivation layer 170, an adhesive member 175, asolder paste 180, an electronic component 190, and a wire 195. Here, theupper conductive layer 130 may be referred to as a first conductivelayer, and the lower conductive layer 150 may be referred to as a secondconductive layer. However, hereinafter, the upper conductive layer andthe lower conductive layer will be referred to as an upper conductivelayer and a lower conductive layer, respectively, depending on positionsin which each of conductive layers is disposed centering on theinsulating substrate 110, in order to differentiate each of theconductive layers.

Referring to FIG. 2, the insulating substrate 110 may have a flat platestructure. The insulating substrate 110 may be a printed circuit board(PCB). Here, the insulating substrate 110 may be implemented as a singlesubstrate, and alternatively, may be implemented as a multilayersubstrate in which a plurality of insulating layers are sequentiallystacked.

Accordingly, the insulating substrate 110 includes a plurality ofinsulating layers 111. As shown in FIG. 2, the plurality of insulatinglayers 111 may include a first insulating layer, a second insulatinglayer, a third insulating layer, a fourth insulating layer, a fifthinsulating layer, and a sixth insulating layer from an uppermostportion. In addition, a circuit pattern 112 may be disposed at each ofsurfaces of the first to sixth insulating layers.

That is, the plurality of insulating layers 111 is a substrate on whichan electrical circuit capable of changing wirings is disposed and mayinclude all of printing, a wiring plate, and an insulating substratewhich are formed of an insulating material which is able to form acircuit pattern 112 at a surface of the insulating layer.

The plurality of insulating layers 111 may be rigid or flexible. Forexample, the insulating layer 111 may include glass or plastic.Specifically, the insulating layer 111 may include a chemicallytempered/semi-tempered glass, such as soda lime glass, aluminosilicateglass, etc., a tempered or flexible plastic such as polyimide (PI),polyethylene terephthalate (PET), propylene glycol (PPG), polycarbonate(PC), etc., or sapphire.

Further, the insulating layer 111 may include an optically isotropicfilm. For example, the insulating layer 111 may include cyclic olefincopolymer (COC), cyclic olefin polymer (COP), optically isotropic PC,optically isotropic polymethylmethacrylate (PMMA), etc.

Furthermore, the insulating layer 111 may be partially bent while havinga curved surface. That is, the insulating layer 111 may partially have aplane and may partially be bent while having a curved surface.Specifically, an end portion of the insulating layer 111 may be bentwhile having a curved surface, or bent or crooked while having a surfacewith a random curvature.

In addition, the insulating layer 111 may be a flexible substrate havingflexibility. Further, the insulating layer 111 may be a curved or bentsubstrate. At this point, the insulating layer 111 may form a wiringlayout for electrical wirings which connect circuit components based ona circuit design, and electrical conductors may be disposed on aninsulating material. Furthermore, electrical components may be mountedon the insulating layer 111, and the insulating layer 111 may formwirings configured to connect the electrical components to make acircuit, and may mechanically fix the components besides functioning toelectrically connect the components.

Each of the circuit patterns 112 is disposed at the surface of theinsulating layer 111. The circuit pattern 112 may be a wiring fortransmitting an electrical signal, and may be formed of a metal materialhaving high electrical conductivity. For this, the circuit pattern 112may be formed of at least one metal material selected from among gold(Au), silver (Ag), platinum (Pt), titanium (Ti), tin (Sn), copper (Cu),and zinc (Zn). In addition, the circuit pattern 112 may be formed ofpaste or solder paste including at least one metal material selectedfrom among gold (Au), silver (Ag), platinum (Pt), titanium (Ti), tin(Sn), copper (Cu), and zinc (Zn), which are excellent in bondingstrength. Preferably, the circuit pattern 112 may be formed of copper(Cu) having high electrical conductivity and a relatively low cost.

The circuit pattern 112 may be formed by a general process ofmanufacturing a PCB, such as an additive process, a subtractive process,a modified semi additive process (MSAP), a semi additive process (SAP),etc., and detailed descriptions thereof will be omitted herein.

At least one via 113 is formed in the insulating layer 111. The via 113is disposed to be passing through at least one of the plurality ofinsulating layers 111. The via 113 may pass through only one of theplurality of insulating layers 111, and alternatively, may be formed tocommonly pass through at least two insulating layers of the plurality ofinsulating layers 111. Accordingly, the via 113 electrically connectscircuit patterns disposed at surfaces of different insulating layers toeach other.

The via 113 may be formed by filling, with a conductive material, athrough hole (not shown) passing through at least one of the pluralityof insulating layers 111.

The through hole may be formed by any one of mechanical, laser, andchemical processing. When the through hole is formed by mechanicalprocessing, a method such as milling, drilling and routing may be used.When the through hole is formed by laser processing, a method of UV orCO₂ laser may be used. And when the through hole is formed by chemicalprocessing, the insulating layer 111 may be opened by using a chemicalincluding aminosilane, ketone, or the like.

Meanwhile, the laser processing is a cutting method in which a part of amaterial is melted and evaporated by concentrating optical energy at asurface to take a desired shape. Complex formation by a computer programmay be easily processed, and composite materials which are difficult tocut by other methods may be processed.

In addition, the processing by the laser may have a cutting diameter ofat least 0.005 mm, and has a wide range of thickness that may beprocessed.

It is preferable to use an yttrium aluminum garnet (YAG) laser or CO₂laser or ultraviolet (UV) laser as the laser processing drill. The YAGlaser is a laser capable of processing both a copper foil layer and aninsulating layer, and the CO₂ laser is a laser capable of processingonly an insulating layer.

When the through hole is formed, the via 113 is formed by filling theinside of the through hole with a conductive material. The metalmaterial forming the via 113 may be anyone selected from among copper(Cu), silver (Ag), tin (Sn), gold (Au), nickel (Ni), and palladium (Pd).The conductive material may be filled by any one of electroless plating,electrolytic plating, screen printing, sputtering, evaporation, inkjetting, and dispensing, or a combination thereof.

The first pad 120 is disposed on the insulating layer disposed at theuppermost portion of the plurality of insulating layers 111 and thesecond pad 140 is disposed under the insulating layer disposed at thelowermost portion of the plurality of insulating layers 111.

In other words, the first pad 120 is disposed on the uppermostinsulating layer 111 in which the electronic component 190 is to beformed, among the plurality of insulating layers 111. The first pad 120may be formed in plural on the uppermost insulating layer. In addition,a part of the first pad 120 may serve as a pattern for signaltransmission and the other part thereof may serve as an inner leadelectrically connected to the electronic component 190 through the wire195. In other words, the first pad 120 includes a wire-bonding pad forwire bonding.

In addition, the second pad 140 is disposed under the lowermostinsulating layer to which an external substrate (not shown) is to beattached, among the plurality of insulating layers 111. Like the firstpad 120, a part of the second pad 140 also serves as a pattern forsignal transmission, and the other part thereof may serve as an outerlead in which the adhesive member 175 is disposed for attachment of theexternal substrate. In other words, the second pad 140 includes asoldering pad for soldering.

In addition, the upper conductive layer 130 is disposed on the first pad120 and the lower conductive layer 150 is disposed under the second pad140. The upper conductive layer 130 and the lower conductive layer 150are formed of the same material and increase characteristics of the wirebonding or soldering while protecting the first pad 120 and the secondpad 140, respectively.

For this, the upper conductive layer 130 and the lower conductive layer150 are formed of a metal including gold (Au). Preferably, the upperconductive layer 130 and the lower conductive layer 150 may include puregold (purity of 99% or more) only, or may be formed of an alloyincluding gold (Au). When the upper conductive layer 130 and the lowerconductive layer 150 are formed of an alloy including gold, the alloymay be formed of a gold alloy including cobalt.

The solder paste 180 is disposed at the uppermost insulating layer amongthe plurality of insulating layers. The solder paste is an adhesive forfixing the electronic component 190 attached to the insulating substrate110. Accordingly, the solder paste 180 may be referred to as anadhesive. The adhesive may be a conductive adhesive, or alternatively,the adhesive may be a non-conductive adhesive. That is, the printedcircuit board 100 may be a substrate to which the electronic component190 is attached in a wire-bonding manner, so that a terminal (not shown)of the electronic component 190 is not disposed on the adhesive. Inaddition, the adhesive is not electrically connected to the electroniccomponent 190. Therefore, a non-conductive adhesive may be used as theadhesive, or alternatively, a conductive adhesive may be used as theadhesive.

The conductive adhesive is largely classified into an anisotropicconductive adhesive and an isotropic conductive adhesive, and isbasically composed of conductive particles such as Ni, Au/polymer, orAg, and thermosetting and thermoplastic resins, or a blend typeinsulating resin mixing characteristics of the two resins.

In addition, the non-conductive adhesive may also be a polymericadhesive and may preferably be a non-conductive polymer adhesiveincluding a thermosetting resin, a thermoplastic resin, a filler, acuring agent, and a curing accelerator.

Further, the first passivation layer 160, through which at least a partof a surface of the upper conductive layer 130 is exposed, is disposedon the uppermost insulating layer. The first passivation layer 160 isdisposed to protect the surface of the uppermost insulating layer, and,for example, may be a solder resist.

In addition, the wire 195 is bonded to the upper conductive layer 130 sothat the first pad 120 and the electronic component 190 may beelectrically connected to each other.

Here, the electronic component 190 may include both a device and a chip.The device may be classified into an active device and a passive device.The active device refers to a device that positively uses non-linearcharacteristics. The passive device refers to a device that does not usenon-linear characteristics even though both linear and non-linearcharacteristics are present. In addition, the passive device may includea transistor, an IC semiconductor chip, and the like and the passivedevice may include a condenser, a resistor, an inductor, and the like.The passive device is mounted on a substrate together with an ordinarysemiconductor package in order to increase a signal processing speed ofa semiconductor chip which is an active device, perform a filteringfunction, or the like.

As a result, the electronic component 190 may include all of asemiconductor chip, a light emitting diode chip, and other drivingchips.

In addition, a resin molding part is formed on the uppermost insulatinglayer, so that the electronic component 190, the wire 195, and thewire-bonded upper conductive layer 130 may be protected by the resinmolding part.

Meanwhile, the second passivation layer 170 is disposed under thelowermost insulating layer among the plurality of insulating layers. Thesecond passivation layer 170 has an opening exposing an surface of thelower conductive layer 150 on which the adhesive member 175 is to bedisposed. The second passivation layer 170 may be formed of a solderresist.

The adhesive member 175 is disposed under the lower conductive layer 150exposed through the opening of the second passivation layer 170. Theadhesive member 175 is a member for soldering.

The adhesive member 175 provides an adhesive force between the printedcircuit board 100 and the external substrate. The adhesive member 175may be formed of a solder ball, or alternatively may be formed by usingan adhesive paste or a copper core solder ball.

In addition, the adhesive paste may be formed of a conductive materialfor electrical conduction, and at this point, when the adhesive paste isformed of the conductive material, the adhesive paste may preferably beformed of a conductive material selected from the group consisting ofcopper, silver, gold, aluminum, carbon nanotubes, and combinationsthereof.

Hereinafter, the first pad 120, the second pad 140, the upper conductivelayer 130, and the lower conductive layer 150 will be described in moredetail.

FIG. 3 is a view specifically illustrating the first pad 120 and theupper conductive layer 130 shown in FIG. 2, and FIG. 4 is a viewspecifically illustrating the second pad 140 and the lower conductivelayer 150 shown in FIG. 2.

Referring to FIGS. 3 and 4, the upper conductive layer 130 and the lowerconductive layer 150 have an overhang structure with respect to thefirst pad 120 and the second pad 140, respectively.

First, referring to FIG. 3, the first pad 120 is disposed on theinsulating layer disposed at the uppermost portion of the plurality ofinsulating layers.

The first pad 120 includes a plating seed layer 121 disposed on theuppermost insulating layer, a first-first pattern 122 disposed on theplating seed layer 121, and a first-second pattern 123 disposed on thefirst-first pattern 122. In addition, the upper conductive layer 130 isdisposed on the first-second pattern 123.

The plating seed layer 121 is disposed on the uppermost insulatinglayer. Preferably, a lower surface of the plating seed layer 121 is indirect contact with an upper surface of the uppermost insulating layer.The upper and lower surfaces of the plating seed layer 121 has the samewidth.

In other words, a width of the upper surface of the plating seed layer121 refers to an actual length from one end of the upper surface of theplating seed layer 121 to the other end thereof, and a width of thelower surface of the plating seed layer 121 refers to an actual lengthfrom one end of the lower surface of the plating seed layer 121 to theother end thereof. Accordingly, a width described below may be definedas an actual length from one end to the other end as described above.

In addition, a horizontal cross section of the plating seed layer 121may have any one of various shapes such as a circular shape, a squareshape, a triangle shape, an ellipse shape, a fan shape, and a starshape.

The plating seed layer 121 may be a seed layer for electrolytic platingof the first-first pattern 122 and the first-second pattern 123 and maybe also a seed layer for electrolytic plating of the upper conductivelayer 130. In other words, the upper conductive layer 130 as well as thefirst-first pattern 122 and the first-second pattern 123 may be formedby electrolytic-plating the plating seed layer 121 as a seed layer.

A circuit pattern part is disposed on the plating seed layer 121. Thecircuit pattern part includes a first-first pattern 122 and afirst-second pattern 123. The first-first pattern 122 and thefirst-second pattern 123 are formed of the same metal material.Preferably, the first-first pattern 122 and the first-second pattern 123may be formed of copper (Cu), or may further include a conductive metalmaterial while including the copper (Cu).

The first-first pattern 122 is formed on the plating seed layer 121. Anupper surface of the first-first pattern 122 has a curvature.Accordingly, a width of a lower surface of the first-first pattern 122is different from that of the upper surface of the first-first pattern122. Here, the width refers to the actual length from one end to theother end as described above, and since the upper surface of thefirst-first pattern 122 has a curvature, the width (actual length) ofthe upper surface of the first-first pattern 122 is larger than that(actual length) of the lower surface of the first-first pattern 122. Atthis point, a straight line distance from one end to the other end ofthe upper surface of the first-first pattern 122 is the same as astraight line distance from one end to the other end of the lowersurface of the first-first pattern 122.

The first-second pattern 123 is disposed on the first-first pattern 122.The first-second pattern 123 is disposed to cover the upper surface ofthe first-first pattern 122. Accordingly, a lower surface of thefirst-second pattern 123 has a curvature corresponding to the uppersurface of the first-first pattern 122. In other words, the uppersurface of the first-first pattern 122 may have a convex shape thatprotrudes upward. In addition, the lower surface of the first-secondpattern 123 may have a concave shape that is recessed inward to coverthe upper surface of the convex first-first pattern 122.

The first-second pattern 123 is disposed to fill a removed edge regionof the first-first pattern 122. Therefore, at least a part of the lowersurface of the first-second pattern 123 is located to be lower than atleast a part of the upper surface of the first-first pattern 122. Atthis point, the first-second pattern 123 covers the entire upper surfaceof the first-first pattern 122. Therefore, the lower surface of thefirst-second pattern 123 is formed such that at least a part of aportion in contact with the upper surface of the first-first pattern 122is located to be lower than at least a part of the upper surface of thefirst-first pattern 122.

Accordingly, an outer side portion of the lower surface of thefirst-second pattern 123 is located to be lower than a remaining centralportion of the upper surface of the first-first pattern 122 except foran outer side portion thereof. That is, an outermost side portion of thelower surface of the first-second pattern 123 is located to be lowerthan the remaining central portion of the upper surface of thefirst-first pattern 122 except for the outer side portion thereof.

Further, the outermost side portion of the lower surface of thefirst-second pattern 123 and an outermost side portion of the uppersurface of the first-first pattern 122 are located to be lower than theremaining central portion of the upper surface of the first-firstpattern 122 except for the outer side portion thereof.

Furthermore, the outermost side portion of the lower surface of thefirst-second pattern 123 and the outermost side portion of the uppersurface of the first-first pattern 122 are located to be lower than boththe remaining central portion of the upper surface of the first-firstpattern 122 except for the outer side portion thereof and a remainingcentral portion of the lower surface of the first-second pattern 123except for the outer side portion thereof.

In addition, a thickness of the outer side portion of the first-secondpattern 123 is larger than that of the central portion of thefirst-second pattern 123.

Accordingly, a distance from the outer side portion of the lower surfaceof the first-second pattern 123 to the uppermost insulating layer in afirst direction perpendicular to the upper surface of the uppermostinsulating layer is smaller than that from the central portion exceptfor the outer side portion of the lower surface of the first-secondpattern 123 to the uppermost insulating layer.

In addition, a thickness of the first-second pattern 123 graduallyincreases toward the outer side portion of the first-second pattern 123from the central portion thereof. On the contrary, a thickness of thefirst-first pattern 122 gradually decreases toward the outer sideportion of the first-first pattern 122 from the central portion thereof.

In addition, a width of the first-second pattern 123 may graduallyincrease toward an upper portion thereof. In other words, at least apart of a side surface of the first-second pattern 123 protrudes in alongitudinal direction than a side surface of the first-first pattern122. In other words, at least a part of a left-side surface of thefirst-second pattern 123 includes a portion that further protrudes in aleft-side longitudinal direction than a left-side surface of thefirst-first pattern 122. Further, at least a part of a right-sidesurface of the first-second pattern 123 includes a portion that furtherprotrudes in a right-side longitudinal direction than a right-sidesurface of the first-first pattern 122.

Meanwhile, the first-first pattern 122 may have a first height H1 andthe first-second pattern 123 may have a second height H2. Here, theheight may refer to a thickness of each of the plating seed layer 121,the first-first pattern 122, and the first-second pattern 123 in avertical direction.

The height of the plating seed layer 121 is lower than the first heightH1 of the first-first pattern 122. That is, the thickness of the platingseed layer 121 is thinner than that of the first-first pattern 122.

Furthermore, the first height H1 of the first-first pattern 122 may behigher than the second height H2 of the first-second pattern 123. Inother words, the thickness of the first-first pattern 122 is thickerthan that of the first-second pattern 123.

At this point, the thickness of the first-second pattern 123 may be in arange of 1 to 13 μm. Preferably, the thickness of the first-secondpattern 123 may be in a range of 3 to 10 μm. More preferably, thethickness of the first-second pattern 123 may be in a range of 3 to 6μm.

That is, when the thickness of the first-second pattern 123 is more than1 μm, an overspreading phenomenon of the upper conductive layeraccording to the present invention may be inhibited, and when the heightof the first-second pattern 123 is in a range from 3 to 6 μm, anoverhang portion of the upper conductive layer 130 may be minimized andthe overspreading phenomenon of the upper conductive layer 130 may beinhibited completely. Here, the overspreading phenomenon may include aphenomenon in which the metal of the upper conductive layer 130 spreadsinto the first-second pattern 123 of the underlying layer in the platingprocess of the upper conductive layer 130. In addition, theoverspreading phenomenon may include a phenomenon in which a metalmaterial constituting the upper conductive layer 130 penetrates into aspace between a mask and the first-second pattern 123 in the platingprocess of the upper conductive layer 130.

The upper conductive layer 130 is disposed on the first-second pattern123. At this point, the upper conductive layer 130 includes anon-contact region not in contact with the first pad 120 and a contactregion in contact with the first pad 120.

In other words, the upper conductive layer 130 includes a contact regionin which the upper conductive layer 130 is in contact with at least oneof the plating seed layer 121, the first-first pattern 122, and thefirst-second pattern 123. At this point, the contact region of the upperconductive layer 130 may be in contact with the first-second pattern123. In other words, a lower surface of the upper conductive layer 130includes a contact portion in which the lower surface of the upperconductive layer 130 is in contact with an upper surface of thefirst-second pattern 123 and the side surface of the first-secondpattern 123.

In addition, the upper conductive layer 130 is spaced apart from theplating seed layer 121, the first-first pattern 122 and the first-secondpattern 123, and includes a non-contact region in which the upperconductive layer 130 is not in contact with all of the plating seedlayer 121, the first-first pattern 122, and the first-second pattern123. In other words, the lower surface of the upper conductive layer 130includes a non-contact portion which is floating in air as the lowersurface of the upper conductive layer 130 is not in contact with theplating seed layer 121, the first-first pattern 122, and thefirst-second pattern 123. At this point, the non-contact portion of thelower surface of the upper conductive layer 130 may be an outer sideportion of the lower surface of the upper conductive layer 130. Further,the contact portion of the lower surface of the upper conductive layer130 may be a remaining central portion of the lower surface of the upperconductive layer 130 except for the outer side portion of the lowersurface thereof.

As described above, the upper conductive layer 130 is not disposed onlyat the upper surface of the first-second pattern 123, but is bent atleast once and disposed also at the side surface of the first-secondpattern 123. In addition, an end portion of a portion of the upperconductive layer 130 which is disposed at the side surface of thefirst-second pattern 123 is spaced apart from the first-second pattern123. As a result, the upper conductive layer 130 has an overhangstructure and is disposed on the first pad 120, more specifically, onthe first-second pattern 123.

Meanwhile, a width of the non-contact portion of the upper conductivelayer 130 may be in a range of 3 to 7 μm. Preferably, the width of thenon-contact portion of the upper conductive layer 130 may be in a rangeof 3 to 4 μm. Here, the width of the non-contact portion may refer to athickness (or length, height, or width) in a longitudinal direction ofthe non-contact portion in the drawing.

Meanwhile, a height H3 of the upper conductive layer 130 may bedetermined by characteristics required in the upper conductive layer130. In other words, a thickness of the upper conductive layer 130 isdetermined by a function of the first pad 120 disposed under the upperconductive layer 130.

Here, the first pad 120 is formed for wire bonding in which the wire 195electrically connected to the electronic component 190 is bonded.Therefore, the upper conductive layer 130 should have a thicknesssufficient to satisfy the wire-bonding characteristics. Accordingly, theupper conductive layer 130 may have a thickness that satisfies a rangeof 0.2 to 0.8 μm. At this point, when the upper conductive layer 130 hasa thickness of less than 0.2 μm, it may not meet criteria required forBPT (BPT specification 5 g or more) after wire bonding. In addition,when the upper conductive layer 130 has a thickness of more than 0.8 μm,there is a problem that a material cost due to excessive use of gold(Au) forming the upper conductive layer 130 is increased. Therefore, inthe present invention, the upper conductive layer 130 has a thicknessthat satisfies the range of 0.2 to 0.8 μm. Here, the thickness of theupper conductive layer 130 may refer to a thickness of the upperconductive layer 130 in a lateral direction.

Meanwhile, as described above, the upper conductive layer 130 of thepresent invention includes only a layer including gold (Au). In otherwords, the upper conductive layer 130 including gold is directlydisposed on the first-second pattern 123 formed of a metal including thecopper.

That is, in the present invention, a nickel layer disposed between acopper layer and gold (Au) of a typical conventional upper conductivelayer is removed. This is because, as the first-second pattern 123 isformed on the first-first pattern 122, the overspreading phenomenon ofthe upper conductive layer 130 (which is clearly described above) may besolved, and the upper conductive layer 130 is formed of the plating seedlayer 121 as a seed layer, which is used at the time of forming thefirst-first pattern 122 and the first-second pattern 123.

At this point, typical copper has so high electrical conductivity ascompared with nickel. That is, the electrical conductivity of the nickelis only about 14.9% of the electrical conductivity of the copper.Therefore, in the present invention, since the first-second pattern 123instead of the nickel layer is formed, a gold (Au) layer may be directlyformed on a copper layer, and thus all of reliability problems caused bythe formation of the nickel can be solved. In other words, in therelated art, there was a problem in the interface characteristicsbetween the first-first pattern 122 and the nickel layer due to thedifference in characteristics between metals occurring between copperand nickel, and there was a problem that the electrical conductivity dueto the nickel layer was lowered. However, in the present invention, anupper conductive layer including gold (Au) is formed by using a platingseed layer used at the time of forming the first-first pattern and thefirst-second pattern, so that a nickel (Ni) seed layer which has servedas a seed layer of a gold (Au) conductive layer in the related art maybe removed, and thus, not only a thickness of a printed circuit boardproduct can be reduced, but also economic efficiency of a product can beimproved by technical effect due to efficiency of a process. Further,according to an embodiment of the present invention, a nickel layer maybe removed from a pattern structure, and thus not only electricalconductivity of a pattern can be improved, but also a problem ofinterface property occurring between copper and nickel constituting thepattern can be solved.

Meanwhile, referring to FIG. 4, the second pad 140 is disposed under theinsulating layer disposed at the lowermost portion of the plurality ofinsulating layers. At this point, as shown in FIG. 4, the lowerconductive layer 150 is disposed on the second pad 140, but FIG. 4substantially illustrates a state in which an actual product is turnedupside down. Hereinafter, for convenience of explanation, it is assumedthat the second pad 140 is formed on the lowermost insulating layeramong the plurality of insulating layers. But, in reality, the secondpad 140 is disposed under a lower surface of the lowermost insulatinglayer, and the lower conductive layer 150 is disposed under the secondpad 140.

The second pad 140 includes a plating seed layer 141 disposed on thelowermost insulating layer, a second-first pattern 142 disposed on theplating seed layer 141, and a second-second pattern 143 disposed on thesecond-first pattern 142. In addition, the lower conductive layer 150 isdisposed on the second-second pattern 143.

The plating seed layer 141 is disposed on the lowermost insulatinglayer. Preferably, a lower surface of the plating seed layer 141 is indirect contact with an upper surface of the lowermost insulating layer.The upper and lower surfaces of the plating seed layer 141 has the samewidth.

The plating seed layer 141 may be a seed layer for electrolytic platingof the second-first pattern 142 and the second-second pattern 143 andmay be also a seed layer for electrolytic plating of the lowerconductive layer 150. In other words, the lower conductive layer 150 aswell as the second-first pattern 142 and the second-second pattern 143may be formed by electrolytic-plating the plating seed layer 141 as aseed layer.

A circuit pattern part of the second pad 140 is disposed on the platingseed layer 141. The circuit pattern part includes a second-first pattern142 and a second-second pattern 143. The second-first pattern 142 andthe second-second pattern 143 are formed of the same metal material.Preferably, the second-first pattern 142 and the second-second pattern143 may be formed of copper (Cu), or may further include a conductivemetal material while including the copper (Cu).

The second-first pattern 142 is formed on the plating seed layer 141. Anupper surface of the second-first pattern 142 has a curvature.Accordingly, a width of a lower surface of the second-first pattern 142is different from that of the upper surface of the second-first pattern142. Here, the width refers to the actual length from one end to theother end as described above, and since the upper surface of thesecond-first pattern 142 has a curvature, the width (actual length) ofthe upper surface of the second-first pattern 142 is larger than that(actual length) of the lower surface of the second-first pattern 142. Atthis point, a straight line distance from one end to the other end ofthe upper surface of the second-first pattern 142 is the same as astraight line distance from one end to the other end of the lowersurface of the second-first pattern 142.

The second-second pattern 143 is disposed on the second-first pattern142. The second-second pattern 143 is disposed to cover the uppersurface of the second-first pattern 142. Accordingly, a lower surface ofthe second-second pattern 143 has a curvature corresponding to the uppersurface of the second-first pattern 142. In other words, the uppersurface of the second-first pattern 142 may have a convex shape thatprotrudes upward. In addition, the lower surface of the second-secondpattern 143 may have a concave shape that is recessed inward to coverthe upper surface of the convex second-first pattern 142.

The second-second pattern 143 is disposed to fill a removed edge regionof the second-first pattern 142. Therefore, at least a part of the lowersurface of the second-second pattern 143 is located to be lower than atleast a part of the upper surface of the second-first pattern 142. Atthis point, the second-second pattern 143 covers the entire uppersurface of the second-first pattern 142. Therefore, the lower surface ofthe second-second pattern 143 is formed such that at least a part of aportion in contact with the upper surface of the second-first pattern142 is located to be lower than at least a part of the upper surface ofthe second-first pattern 142.

Accordingly, an outer side portion of the lower surface of thesecond-second pattern 143 is located to be lower than a remainingcentral portion of the upper surface of the second-first pattern 142except for an outer side portion thereof. That is, an outermost sideportion of the lower surface of the second-second pattern 143 is locatedto be lower than the remaining central portion of the upper surface ofthe second-first pattern 142 except for the outer side portion thereof.

In addition, the outermost side portion of the lower surface of thesecond-second pattern 143 and an outermost side portion of the uppersurface of the second-first pattern 142 are located to be lower than theremaining central portion of the upper surface of the second-firstpattern 142 except for the outer side portion thereof.

Further, the outermost side portion of the lower surface of thesecond-second pattern 143 and the outermost side portion of the uppersurface of the second-first pattern 142 are located to be lower thanboth the remaining central portion of the upper surface of thesecond-first pattern 142 except for the outer side portion thereof and aremaining central portion of the lower surface of the second-secondpattern 143 except for the outer side portion thereof.

In addition, a thickness of the outer side portion of the second-secondpattern 143 is larger than that of the central portion of thesecond-second pattern 143.

Accordingly, a distance from the outer side portion of the lower surfaceof the second-second pattern 143 to the lowermost insulating layer inthe first direction perpendicular to the upper surface of the lowermostinsulating layer is smaller than that from the central portion exceptfor the outer side portion of the lower surface of the second-secondpattern 143 to the lowermost insulating layer.

In addition, a thickness of the second-second pattern 143 graduallyincreases toward the outer side portion of the second-second pattern 143from the central portion thereof. On the contrary, a thickness of thesecond-first pattern 142 gradually decreases toward the outer sideportion of the second-first pattern 142 from the central portionthereof.

In addition, a width of the second-second pattern 143 may graduallyincrease toward an upper portion thereof. In other words, at least apart of a side surface of the second-second pattern 143 protrudes in alongitudinal direction than a side surface of the second-first pattern142. In other words, at least a part of a left-side surface of thesecond-second pattern 143 includes a portion that further protrudes in aleft-side longitudinal direction than a left-side surface of thesecond-first pattern 142. Further, at least a part of a right-sidesurface of the second-second pattern 143 includes a portion that furtherprotrudes in a right-side longitudinal direction than a right-sidesurface of the second-first pattern 142.

Meanwhile, the second-first pattern 142 may have a fourth height H4 andthe second-second pattern 143 may have a fifth height H5. Here, theheight may refer to a thickness of each of the plating seed layer 141,the second-first pattern 142, and the second-second pattern 143 in avertical direction.

The height of the plating seed layer 141 is lower than the fourth heightH4 of the second-first pattern 142. That is, the thickness of theplating seed layer 141 is thinner than that of the second-first pattern142.

Furthermore, the fourth height H4 of the second-first pattern 142 may behigher than the fifth height H5 of the second-second pattern 143. Inother words, the thickness of the second-first pattern 142 is thickerthan that of the second-second pattern 143.

At this point, the thickness of the second-second pattern 143 may be ina range of 1 to 13 μm. Preferably, the thickness of the second-secondpattern 143 may be in a range of 3 to 10 μm. More preferably, thethickness of the second-second pattern 143 may be in a range of 3 to 6μm.

That is, when the height of the second-second pattern 143 is more than 1μm, an overspreading phenomenon of the lower conductive layer accordingto the present invention may be inhibited, and when the height of thesecond-second pattern 143 is in a range from 3 to 6 μm, an overhangportion of the lower conductive layer 150 may be minimized and theoverspreading phenomenon of the lower conductive layer 150 may beinhibited completely. Here, the overspreading phenomenon may include aphenomenon in which the metal of the lower conductive layer 150 spreadsinto the second-second pattern 143 of the underlying layer in theplating process of the lower conductive layer 150. In addition, theoverspreading phenomenon may include a phenomenon in which a metalmaterial constituting the lower conductive layer 150 penetrates into aspace between a mask and the second-second pattern 143 in the platingprocess of the lower conductive layer 150.

The lower conductive layer 150 is disposed on the second-second pattern143. At this point, the lower conductive layer 150 includes anon-contact region not in contact with the second pad 140 and a contactregion in contact with the second pad 140.

In other words, the lower conductive layer 150 includes a contact regionin which the lower conductive layer 150 is in contact with at least oneof the plating seed layer 141, the second-first pattern 142, and thesecond-second pattern 143. At this point, the contact region of thelower conductive layer 150 may be in contact with the second-secondpattern 143. In other words, a lower surface of the lower conductivelayer 150 includes a contact portion in which the lower surface of thelower conductive layer 150 is in contact with an upper surface of thesecond-second pattern 143 and the side surface of the second-secondpattern 143.

Further, the lower conductive layer 150 is spaced apart from the platingseed layer 141, the second-first pattern 142 and the second-secondpattern 143, and includes a non-contact region in which the lowerconductive layer 150 is not in contact with all of the plating seedlayer 141, the second-first pattern 142, and the second-second pattern143. In other words, the lower surface of the lower conductive layer 150includes a non-contact portion which is floating in air as the lowersurface of the lower conductive layer 150 is not in contact with theplating seed layer 141, the second-first pattern 142, and thesecond-second pattern 143. At this point, the non-contact portion of thelower surface of the lower conductive layer 150 may be an outer sideportion of the lower surface of the lower conductive layer 150.Furthermore, the contact portion of the lower surface of the lowerconductive layer 150 may be a remaining central portion of the lowersurface of the lower conductive layer 150 except for the outer sideportion of the lower surface thereof.

As described above, the lower conductive layer 150 is not disposed onlyat the upper surface of the second-second pattern 143, but is bent atleast once and disposed also at the side surface of the second-secondpattern 143. In addition, an end portion of a portion of the lowerconductive layer 150 which is disposed at the side surface of thesecond-second pattern 143 is spaced apart from the second-second pattern143. As a result, the lower conductive layer 150 has an overhangstructure and is disposed on the second pad 140, more specifically, onthe second-second pattern 143.

Meanwhile, a width of the non-contact portion of the lower conductivelayer 150 may be in a range of 2 to 6 μm. Preferably, the width of thenon-contact portion of the lower conductive layer 150 may be in a rangeof 2 to 3 μm.

Here, the width of the non-contact portion of the lower conductive layer150 may refer to a thickness (or length, height, or width) in alongitudinal direction in the drawing.

At this point, a thickness of the lower conductive layer 150 and thethickness of the upper conductive layer 130 are different from eachother. Accordingly, the width of the non-contact portion in the lowerconductive layer 150 is different from that of the non-contact portionin the upper conductive layer 130. Preferably, the upper conductivelayer 130 is thicker than the lower conductive layer 150 so that thewidth of the non-contact portion in the lower conductive layer 150 maybe smaller than that of the non-contact portion in the upper conductivelayer 130.

In other words, each of the upper conductive layer 130 and the lowerconductive layer 150 may include a first region in direct contact withan upper surface of the first or second pad, a second region extendingfrom the first region and in direct contact with a side surface of thefirst or second pad, and a third region extending from the second regionand spaced from the first and second pads.

Further, the thickness of the upper conductive layer 130 in thelongitudinal direction of the first region may be greater than that ofthe lower conductive layer 150 in the longitudinal direction of thefirst region. Furthermore, the thickness of the upper conductive layer130 in the lateral direction of the second region may be greater thanthat of the lower conductive layer 150 in the lateral direction of thesecond region.

In addition, an end portion of the third region of the upper conductivelayer 130 is located to be higher than the outer side region of theupper surface of the first-first pattern constituting the first pad, andan end portion of the third region of the lower conductive layer 150 islocated to be lower than the outer side region of the lower surface ofthe second-first pattern constituting the second pad.

Furthermore, the thickness of the upper conductive layer 130 in thelongitudinal direction of the third region may be different from that ofthe lower conductive layer 150 in the longitudinal direction of thethird region.

In the present invention, the thickness of the third region in the upperconductive layer or the lower conductive layer may be minimized by thedifference in thickness, and thus a problem occurring due to the thirdregion deviated from the second region can be minimized.

Meanwhile, a height H6 of the lower conductive layer 150 may bedetermined by characteristics required in the lower conductive layer150. In other words, the thickness of the lower conductive layer 150 isdetermined by a function of the second pad 140 disposed under the lowerconductive layer 150.

At this point, the second pad 140 is formed for soldering bonding to bebonded to an external substrate. Therefore, the lower conductive layer150 should have a thickness sufficient to satisfy the solderingcharacteristics. Accordingly, the lower conductive layer 150 may have athickness that satisfies a range of 0.05 to 0.3 μm. At this point, whenthe lower conductive layer 150 has a thickness of less than 5 μm, thesecond-second pattern which is an underlying layer may be exposed. Inaddition, when the lower conductive layer 150 has a thickness of morethan 0.3 μm, there is a problem that a material cost due to excessiveuse of gold (Au) forming the lower conductive layer 150 is increased.Therefore, in the present invention, the lower conductive layer 150 hasa thickness that satisfies a range of 0.05 to 0.3 μm. Meanwhile, in therange of the thickness of the lower conductive layer 150, the thicknessof the upper conductive layer 130 is included. At this point, eventhough some values in the thickness range overlap, the thicknesses ofthe lower conductive layer 150 and the upper conductive layer 130 areformed to be different from each other. For example, when the thicknessof the lower conductive layer 150 is 0.3 μm, the upper conductive layer130 may have a thickness in a range of 0.31 to 0.8 μm which is largerthan 0.3 μm but not in a range of 0.2 to 0.8 μm.

Meanwhile, as described above, the lower conductive layer 150 of thepresent invention includes only a layer including gold (Au). In otherwords, the lower conductive layer 150 including gold is directlydisposed on the second-second pattern 143 formed of a metal includingthe copper.

Meanwhile, as described above, the upper conductive layer 130 and thelower conductive layer 150 are formed of the same metal material andformed in the same process, but have different thicknesses. In otherwords, the upper conductive layer 130 formed on the first pad 120 formedfor wire bonding is thicker than the lower conductive layer 150 formedon the second pad 140 formed for soldering.

At this point, in the present invention, the upper conductive layer 130and the lower conductive layer 150 are introduced into one plating tank,and accordingly, the plating process is performed at both surfaces ofthe insulating substrate 110 simultaneously, so that the upperconductive layer 130 and the lower conductive layer 150 having differentthicknesses are formed.

Meanwhile, the overhang structure of the upper metal layer shown inFIGS. 3 and 4 is merely an embodiment, and the structure of the overhangmay be variously modified.

FIGS. 5(a)-5(c) are views illustrating a modified example of an overhangstructure shown in FIGS. 3 and 4.

Referring to FIGS. 5(a)-5(c), the lower surface of the upper conductivelayer 130 may be in contact with only the upper surface of thefirst-second pattern 123. In other words, in FIG. 3, the upperconductive layer 130 is in contact with not only the upper surface ofthe first-second pattern 123 but also the side surface thereof. But, asshown in FIG. 5(a), the lower surface of the upper conductive layer 130may be in contact with only the upper surface of the first-secondpattern 123, and accordingly, the lower surface of the upper conductivelayer 130 may extend in a direction parallel to the upper surface of thefirst-second pattern 123.

In addition, as shown in FIG. 5(b), the lower surface of the upperconductive layer 130 may be in contact with both the upper surface andthe side surface of the first-second pattern 123. However, thenon-contact region of the upper conductive layer 130 may have a shapethat is not extended in a direction perpendicular to the upper surfaceof the upper conductive layer 130, but is bent in an outward direction.

Further, as shown in FIG. 5(c), the lower surface of the upperconductive layer 130 may be in contact with both the upper surface andthe side surface of the first-second pattern 123. However, thenon-contact region of the upper conductive layer 130 may have a shapethat is not extended in a direction perpendicular to the upper surfaceof the upper conductive layer 130, but is bent in an inward direction.

Although the upper conductive layer 130 and the lower conductive layer150 are formed simultaneously in the related art, the upper conductivelayer 130 and the lower conductive layer 150 have the same thickness dueto a manufacturing process problem. This is because an adsorption amountof gold ions, which is the metal material forming each of the conductivelayers, did not react to a current change. In other words, in therelated art, the insulating substrate 110 was vertically introduced in avertical plating tank, so that upper and lower surfaces of theinsulating substrate 110 were respectively plated.

At this point, a space for plating at the upper surface of theinsulating substrate 110 in the plating tank and a space for plating atthe lower surface of the insulating substrate 110 were connected to eachother, so that a plating solution was freely moved between the uppersurface region and the lower surface region. Accordingly, even thoughthe plating current for the upper surface and the plating current forthe lower surface were differently applied to each other, due to highconductivity of gold plating solution and limitation of a rack equipmentmechanism of a plating apparatus, it was indicated that an adsorptionamount of gold ions formed in each of regions was similar, so that itwas difficult to control the upper conductive layer 130 and the lowerconductive layer 150 to a desired thickness.

Meanwhile, as described above, in the conventional plating apparatus,when plating is performed with a plating solution of copper (Cu) ornickel (Ni) instead of gold (Au), since conductivity and ion-mobility ofthe copper or nickel are remarkably lower than those of gold, it isdifficult to form different plating layers at both surfaces even in theopen state as described above.

However, when gold is plated, there is a situation where ions transferto an opposite surface at different current densities due to mobilityand high conductivity of the gold ions, so that the upper conductivelayer 130 and the lower conductive layer 150, which are formed at theboth surfaces, have the same thickness.

In addition, as described above, since an area of the first pad 120 isnarrower than that of the second pad 140 and an plating area withrespect to the second pad 140 is larger than that of the first pad 120,in the related art, when the same current density is applied in theplating process, a current with respect to the second pad 140 having alarge area flows toward the first pad 120 having the small area, and asa result, a conductive layer having the same thickness is formed at thefirst pad 120 and the second pad 140.

On the other hand, in the present invention, the upper conductive layer130 and the lower conductive layer 150 are formed by a new method, sothat the upper conductive layer 130 and the lower conductive layer 150may be formed to have different thicknesses even by simultaneouslyplating both surfaces of the insulating substrate 110.

FIG. 6 is a view illustrating a plating apparatus according to anembodiment of the present invention, and FIG. 7 is a view illustrating adetailed structure of a substrate support of the plating apparatus shownin FIG. 6.

Referring to FIG. 6, a plating apparatus 200 includes a plating tank 210in which a gold plating solution is accommodated, a plurality ofelectrodes 240, 250, 260 and 270, a first pedestal 220 and a secondpedestal 230.

A gold (Au) plating solution is accommodated in the plating tank 210. Inaddition, the inside of the plating tank 210 is divided into a firstplating space 211 and a second plating space 212. In addition, theplurality of electrodes include a first anode electrode 240 for platingthe upper surface of at least one substrate which is introduced into thefirst plating space 211 and a second anode electrode 250 for plating thelower surface of at least one substrate which is introduced into thefirst plating space 211. In addition, a cathode electrode for plating asubstrate which is introduced into the first plating space 211 isdisposed in the first pedestal 220.

In addition, the plurality of electrodes include a third anode electrode260 for plating the upper surface of at least one substrate which isintroduced into the second plating space 212 and a fourth anodeelectrode 270 for plating the lower surface of at least one substratewhich is introduced into the second plating space 212. In addition, acathode electrode for plating a substrate which is introduced into thesecond plating space 212 is disposed in the second pedestal 230.

Meanwhile, a first insertion part 221 capable of inserting at least onesubstrate vertically is formed in the first pedestal 220. Further, asecond insertion part 231 capable of inserting at least one substratevertically is formed also in the second pedestal 230.

Furthermore, a substrate for plating is vertically inserted into each ofthe first insertion part 221 and the second insertion part 231, so thata plating process with respect to the upper and lower surfaces of thesubstrate is performed.

At this point, the plating process with respect to the upper and lowersurfaces of the substrate may be sequentially performed, oralternatively, the plating process may be performed simultaneously.Meanwhile, in the present invention, a current supplied to the firstanode electrode 240 and the third anode electrode 260 and a currentsupplied to the second anode electrode 250 and the fourth anodeelectrode 270 are different from each other. At this point, in therelated art, the plating solution was freely moved in the first pedestal220 and the second pedestal 230, and even though a current control wasperformed as described above, the thicknesses of plating at the upperand lower surfaces were equal to each other.

In addition, a width of the first pad 120 and a width of the second pad140 are different from each other. Preferably, since the first pad 120is used for wire bonding, the first pad 120 may be formed to have awidth sufficient to secure a wire-bonding space, and the second pad 140should have a sufficient space in which the adhesive member 175 may bedisposed. Therefore, the first pad 120 has a first width and the secondpad 140 has a second width, and at this point, the first width isnarrower than the second width. In other words, since the first pad 120and the second pad 140 have different widths, in the related art, it isdifficult to form a conductive layer having a desired thickness on thefirst pad 120 and the second pad 140, respectively.

However, in the present invention, the plating process proceeds in anindependent space (a separated space blocked by the pedestal) withrespect to the upper and lower surfaces of the substrate, so that it ispossible to precisely control a desired thickness through the currentcontrol. Referring to FIG. 7, a first insertion part into which thesubstrate 100 is inserted is formed in the first pedestal 220, and thesubstrate 100 is inserted into the formed insertion part.

At this point, a first sealing part 280 surrounds a region into whichthe substrate is inserted, and a blocking part 290 for separating theleft and right regions of the first pedestal 220 is also formed at aperiphery of the first sealing part 280. At this point, the blockingpart 290 is formed at a higher position than the plating solutionsupplied into the plating tank.

Accordingly, the first sealing part 280 and the blocking part 290surround the space around the substrate inserted into the first pedestal220, so that the upper and lower surfaces of the inserted substrate maybe plated by using independent spaces, that is, separate platingsolutions.

Therefore, in the present invention, current density conditions forplating at the upper surface of the substrate and current densityconditions for plating at the lower surface of the substrate are applieddifferently, so that the plating is proceeded at an exact thicknessrequired by each of the conductive layers.

According to an embodiment of the present invention, since a secondpattern filling an edge region of a first pattern is formed on the firstpattern, and a conductive layer is formed on the formed second pattern,it is possible to solve a reliability problem that occurs when aconductive layer permeates into a mask.

Further, according to an embodiment of the present invention, aconductive layer is formed after the second pattern is formed, so that aportion of the conductive layer, protruding from a side surface of a padto an outside may be minimized, and thus structural reliability(stability) of the conductive layer can be secured.

Furthermore, according to an embodiment of the present invention, aconductive layer is formed after the second pattern is formed, so that aportion of a lower surface of the second pattern is disposed to be lowerthan an upper surface of the first pattern, and a thickness of thesecond pattern is thinner than that of the first pattern, and thusoverspreading itself of the conductive layer can be inhibited.

In addition, according to an embodiment of the present invention, aconductive layer including gold (Au) is formed by using a plating seedlayer used at the time of forming the first pattern and the secondpattern, so that a nickel (Ni) seed layer which has served as a seedlayer of a gold (Au) conductive layer in the related art may be removed,and thus, not only a thickness of a printed circuit board product can bereduced, but also economic efficiency of a product can be improved bytechnical effect due to efficiency of a process.

Further, according to an embodiment of the present invention, a nickellayer may be removed from a pattern structure, and thus not onlyelectrical conductivity of a pattern can be improved, but also a problemof interface property occurring between copper and nickel constitutingthe pattern can be solved.

Furthermore, according to an embodiment of the present invention, athickness of an upper conductive layer disposed on a pad for wirebonding and a thickness of a lower conductive layer disposed on a padfor soldering are differently applied, so that a consumption cost ofgold used in the conductive layer may be reduced, and thus a thicknesscan be reduced.

In addition, according to an embodiment of the present invention, aplurality of conductive layers having different thicknesses may beformed by one simultaneous process, and thus efficiency in amanufacturing process can be improved.

Hereinafter, a method for manufacturing a printed circuit boardaccording to an embodiment of the present invention will be described indetail.

FIGS. 8 to 15 are views for explaining a process sequence of a method ofmanufacturing a printed circuit board according to an embodiment of thepresent invention.

First, a multilayer insulating substrate 110 is manufactured. This isbecause an insulating layer 111 is prepared, a metal layer (not shown)is formed on the insulating layer 111, and the formed metal layer isetched to form a circuit pattern 112. Then, an additional insulatinglayer is stacked on both surfaces of the insulating layer 111 on whichthe circuit pattern is formed, and accordingly, the metal layer formingand etching process may be repeatedly performed to manufacture themultilayer insulating substrate 110. At this point, a via 113 may beformed by performing a via hole forming process and a metal materialfilling process in a portion where the via 113 is required in theprocess of stacking the insulating layer.

At this point, the process of manufacturing the multilayer insulatingsubstrate 110 is well known in the art, and thus a detailed descriptionthereof will be omitted.

Then, metal layers 125 and 145 are formed at the uppermost insulatinglayer and the lowermost insulating layer, respectively, of themultilayer insulating substrate 110.

The metal layers 125 and 145 serve as a seed layer forelectrolytic-plating first and second pads 120 and 140 and upper andlower conductive layers 130 and 150.

The metal layers 125 and 145 may be formed by electroless plating. Atthis point, when the metal layers 125 and 145 are formed by electrolessplating, roughness may be introduced to the surfaces of the uppermostinsulating layer and the lowermost insulating layer for performing easyplating.

An electroless plating method may be processed by sequentiallyperforming a degreasing process, a soft corrosion process, a preliminarycatalyst processing process, a catalyst processing process, anactivation process, an electroless plating process, and an oxidationinhibition processing process. Further, the metal layers 125 and 145 maybe formed by sputtering metal particles using plasma instead of plating.

At this point, a de-smear process which removes smears of the surfacesof the uppermost insulating layer and the lowermost insulating layer maybe additionally performed before plating the metal layers 125 and 145.The de-smear process is performed to make the surfaces of the uppermostinsulating layer and the lowermost insulating layer rough to makeplating easy for forming the metal layers 125 and 145.

Then, referring to FIG. 9, a mask 115 is formed on the metal layers 125and 145. At this point, the mask 115 has an opening exposing at least apart of the surfaces of the metal layers 125 and 145 to form the firstpad 120 and the second pad 140. At this point, a dry film may be used asthe mask 115.

Meanwhile, since the width of the first pad 120 and the width of thesecond pad 140 are different from each other, a width of the opening ofthe mask disposed on the uppermost insulating layer and a width of theopening of the mask disposed under the lowermost insulating layer may bedifferent from each other.

At this point, the mask may be subjected to a plasma processing process.The plasma processing process is performed selectively and is not anecessary process to be included. However, when the plasma processingprocess was performed, the non-contact portions of the upper conductivelayer 130 and the lower conductive layer 150 had different widths orshapes, and a better width or shape appeared in the case in which theplasma processing proceeded. Therefore, in order to obtain a betterresult, it may be preferable that the plasma processing process beperformed.

Then, when the mask 115 is formed, a first plating layer 122 a and asecond plating layer 142 a filling the openings of the mask 115 areformed by electrolytic plating with the metal layers 125 and 145 as aseed layer. The first plating layer 122 a and the second plating layer142 a may be formed by electrolytic-plating a conductive material, forexample, a metal including copper.

Then, referring to FIG. 10, via a polishing operation, a polishingprocess is performed to polish surfaces of the first plating layer 122 aand the second plating layer 142 a and a surface of the mask 115.

The polishing process refers to an operation of flatly polishing thesurfaces of the plated first plating layer 122 a and second platinglayer 142 a, so that polished first plating layer 122 b and secondplating layer 142 b are formed.

At this point, in the polishing process, the polished first and secondplating layers 122 b and 142 b have an overspreading phenomenon in whichthe upper surfaces of the polished first plating layer 122 b and thesecond plating layer 142 b protrude long in a longitudinal direction. Inother words, when the polishing process is performed, the first platinglayer 122 b and the second plating layer 142 b are spread into the mask115. Therefore, the polished first plating layer 122 b includes a firstoverspreading region (a) that overspreads into the mask, and the secondplating layer 142 b also includes a second overspreading region (b) thatoverspreads into the mask.

Then, referring to FIG. 11, when the polishing process is performed,upper regions of the polished first plating layer 122 b and secondplating layer 142 b are etched via a preprocessing process. Here, whenthe preprocessing process is performed, not only the upper surfaces ofthe polished first plating layer 122 b and the second plating layer 142b are etched, but also etching occurs at an interface between the uppersurface and a side surface thereof.

Therefore, when the preprocessing process is completed, a first-firstpattern 122 and a second-first pattern 142 having upper surfaces with apredetermined curvature are formed.

Then, referring to FIG. 12, when the preprocessing process is completed,a first-second pattern 123 and a second-second pattern 143 are formed onthe first-first pattern 122 and the second-first pattern 142 viaperforming a flash plating process.

When the flash plating process is completed, as shown in FIG. 13, anupper conductive layer 130 is formed on the first-second pattern 123,and a lower conductive layer 150 is formed on the second-second pattern143.

At this point, the upper conductive layer 130 and the lower conductivelayer 150 are formed to have different thicknesses.

Then, as shown in FIG. 14, the mask 115 disposed on the metal layer isremoved.

As shown in FIG. 15, the metal layers 125 and 145 are etched to removeremaining portions except for the seed layer disposed under thefirst-first pattern 122 and the second-first pattern 142. At this point,in the etching process of the metal layers 125 and 145, at least a partof the side surfaces of the first-first pattern 122, the first-secondpattern 123, the second-first pattern 142 and the second-second pattern143 may be etched. Therefore, the upper conductive layer 130 and thelower conductive layer 150 have an overhang structure as shown in thedrawing.

According to an embodiment of the present invention, since a secondpattern filling an edge region of a first pattern is formed on the firstpattern, and an upper conductive layer and a lower conductive layer areformed on the formed second pattern, respectively, it is possible tosolve a reliability problem that occurs when the upper conductive layeror the lower conductive layer permeates into a mask.

In addition, according to an embodiment of the present invention, anupper conductive layer or a lower conductive layer is formed after thesecond pattern is formed, so that a portion, protruding from a sidesurface of a pad to an outside thereof, of the upper conductive layerand the lower conductive layer may be minimized, and thus structuralreliability (stability) of the upper conductive layer and the lowerconductive layer can be secured.

Further, according to an embodiment of the present invention, an upperconductive layer and a lower conductive layer are formed after thesecond pattern is formed, so that a portion of a lower surface of thesecond pattern may be disposed to be lower than an upper surface of thefirst pattern, and a thickness of the second pattern may be thinner thanthat of the first pattern, and thus overspreading itself of the upperconductive layer or the lower conductive layer can be inhibited.

Furthermore, according to an embodiment of the present invention, anupper conductive layer and a lower conductive layer including gold (Au)are formed by using a plating seed layer used at the time of forming thefirst pattern and the second pattern, so that a nickel (Ni) seed layerwhich has served as a seed layer of a gold (Au) conductive layer in therelated art may be removed, and thus, not only a thickness of a printedcircuit board product can be reduced, but also economic efficiency of aproduct can be improved by technical effect due to efficiency of aprocess.

In addition, according to an embodiment of the present invention, anickel layer may be removed from a pattern structure, and thus not onlyelectrical conductivity of a pattern can be improved, but also a problemof interface property occurring between copper and nickel constitutingthe pattern can be solved.

Further, according to an embodiment of the present invention, athickness of an upper conductive layer disposed on a pad for wirebonding and a thickness of a lower conductive layer disposed on a padfor soldering are differently applied, so that a consumption cost ofgold used for the upper conductive layer and the lower conductive layermay be reduced, and thus a thickness can be reduced.

Furthermore, according to an embodiment of the present invention, aplurality of conductive layers having different thicknesses may beformed by one simultaneous process, respectively, and thus efficiency ina manufacturing process can be improved.

The characteristics, structures and effects described in the embodimentsabove are included in at least one embodiment but are not limited to oneembodiment. Furthermore, the characteristics, structures, effects, andthe like illustrated in each of the embodiments may be combined ormodified even with respect to other embodiments by those of ordinaryskill in the art to which the embodiments pertain. Thus, it would beconstrued that contents related to such a combination and such amodification are included in the scope of the embodiments. Embodimentsare mostly described above. But, they are only examples and do not limitthe embodiments. A person skilled in the art to which the embodimentspertain may appreciate that several variations and applications notpresented above may be made without departing from the essentialcharacteristic of the embodiments. For example, each componentparticularly represented in the embodiments may be varied. In addition,it should be construed that differences related to such a variation andsuch an application are included in the scope of the embodiment definedin the following claims.

1. A printed circuit board comprising: an insulating layer; a first paddisposed on a first surface of the insulating layer; a first conductivelayer disposed on the first pad and including gold (Au); a second paddisposed on a second surface of the insulating layer; and a secondconductive layer disposed on the second pad and including gold (Au),wherein the first conductive layer includes a first region in contactwith the first pad and a second region spaced apart from the first pad,wherein the second conductive layer includes a first region in contactwith the second pad and a second region spaced apart from the secondpad, and wherein the first conductive layer is thicker than the secondconductive layer.
 2. The printed circuit board of claim 1, wherein thefirst conductive layer is connected to a wire, and wherein the secondconductive layer is connected to a solder.
 3. The printed circuit boardof claim 1, wherein the insulating layer includes a plurality ofinsulating layers, wherein the first pad is disposed on an upper surfaceof a first insulating layer disposed at an uppermost portion of theplurality of insulating layers, and wherein the second pad is disposedunder a lower surface of a second insulating layer disposed at alowermost portion of the plurality of insulating layers.
 4. The printedcircuit board of claim 1, wherein the first pad has a narrower widththan the second pad.
 5. The printed circuit board of claim 1, whereinthe first conductive layer and the second conductive layer are formed byelectrolytic plating.
 6. The printed circuit board of claim 3, whereineach of the first pad and the second pad includes: a plating seed layerdisposed at a surface of the uppermost insulating layer or the lowermostinsulating layer and including copper; a first pattern disposed on theplating seed layer and including copper; and a second pattern disposedon the first pattern and including copper.
 7. The printed circuit boardof claim 6, wherein the first pattern of the first pad is thicker thanthe second pattern of the first pad, and wherein the first pattern ofthe second pad is thicker than the second pattern of the second pad. 8.The printed circuit board of claim 6, wherein a central portion of anupper surface of the first pattern of the first pad is located higherthan an outer side portion of the first pattern of the first pad, andwherein a central portion of an upper surface of the first pattern ofthe second pad is located higher than an outer side portion of the firstpattern of the second pad.
 9. The printed circuit board of claim 6,wherein a width of an upper surface of the first pattern of the firstpad is larger than a width of a lower surface of the first pattern ofthe first pad, and wherein a width of an upper surface of the firstpattern of the second pad is larger than a width of a lower surface ofthe first pattern of the second pad.
 10. The printed circuit board ofclaim 6, wherein the first region of the first conductive layer is indirect physical contact with the second pattern of the first pad and thesecond region of the first conductive layer extends from the firstregion of the first conductive layer and is spaced apart from theplating seed layer of the first pad, the first pattern of the first pad,and the second pattern of the first pad, and wherein the second regionof the first conductive layer is not in physical contact with any of theplating seed layer of the first pad, the first pattern of the first pad,and the second pattern of the first pad.
 11. The printed circuit boardof claim 10, wherein the first region of the second conductive layer isin direct physical contact with the second pattern of the second pad andthe second region of the second conductive layer extends from the firstregion of the second conductive layer and is spaced apart from theplating seed layer of the second pad, the first pattern of the secondpad, and the second pattern of the second pad, and wherein the secondregion of the second conductive layer is not in physical contact withany of the plating seed layer of the second pad, the first pattern ofthe second pad, and the second pattern of the second pad.
 12. A printedcircuit board comprising: an insulating layer; a first pad disposed on afirst surface of the insulating layer; a second pad disposed on a secondsurface of the insulating layer opposite to the first surface; and afirst conductive layer disposed on the first pad, wherein the firstconductive layer includes: a first region in direct physical contactwith an upper surface of the first pad; and a second region extendingfrom the first region and spaced apart from the first pad, and wherein awidth of an upper surface of the first pad is larger than that of alower surface thereof.
 13. The printed circuit board of claim 12,wherein the first conductive layer includes a third region disposedbetween the first region and the second region, and in direct physicalcontact with a side surface of the first pad.
 14. The printed circuitboard of claim 12, wherein the first conductive layer includes gold(Au), wherein the printed circuit board includes a second conductivelayer disposed on the second pad and including gold (Au), and whereinthe second conductive layer includes a first region in direct physicalcontact with a lower surface of the second pad and a second regionextending from the first region and spaced apart from the second pad.15. The printed circuit board of claim 14, wherein a thickness, in alongitudinal direction perpendicular to the first surface of theinsulating layer, of the first region of the first conductive layer isgreater than a thickness, in the longitudinal direction, of the firstregion of the second conductive layer.
 16. The printed circuit board ofclaim 12, comprising an electronic component on the first surface of theinsulating layer.
 17. The printed circuit board of claim 14, whereineach of the first pad and the second pad includes: a plating seed layerdisposed on the first surface or the second surface of the insulatinglayer and including copper; a first pattern disposed on the plating seedlayer and including copper; and a second pattern disposed on the firstpattern and including copper.
 18. The printed circuit board of claim 17,wherein an end portion of the second region of the first conductivelayer is located higher than an outer side region of an upper surface ofthe first pattern of the first pad, and wherein an end portion of thesecond region of the second conductive layer is located lower than anouter side region of a lower surface of the first pattern of the secondpad.
 19. The printed circuit board of claim 14, wherein a thickness, ina longitudinal direction perpendicular to the first surface of theinsulating layer, of the second region of the first conductive layer isdifferent from a thickness, in the longitudinal direction, of the secondregion of the second conductive layer.
 20. The printed circuit board ofclaim 14, wherein the first conductive layer is directly connected to awire, and wherein the second conductive layer is directly connected to asolder.